DYNALAS
1.Technical Principle
The Laser Substrate Heater uses a high-energy laser beam to selectively heat specific regions of the substrate, achieving rapid temperature increase and precise temperature control. Its core mechanisms include:
- Directional Energy Input: The laser beam (wavelength 900-1064 nm) is focused onto the substrate surface (spot size 50-500 μm), with an energy density reaching 10⁵-10⁶ W/cm², enabling local temperature to rise to 300-1000°C within milliseconds;
- Non-Contact Heating: Avoids overall substrate temperature rise caused by traditional heat conduction, reducing thermal stress and warpage (<5 μm);
- Dynamic Temperature Control System: Combines infrared temperature measurement (accuracy ±0.5°C) with PID closed-loop feedback to achieve real-time temperature control with ±1°C.
2. Comparison of Core Advantages
| Indicator | Traditional Heating Methods (e.g., Reflow Soldering) | Laser Substrate Heater | Improvement Amplitude |
|---|---|---|---|
| Heating Speed | 5-10℃/s | 200℃/s |
20 times
|
| Heat-Affected Zone (HAZ) | >100μm | <10μm |
Reduce by 90%
|
| Temperature Uniformity | ±5℃ | ±1℃ |
Increase by 80%
|
| Applicable Materials | Uniform Heat-Conductive Material | Dissimilar Materials (e.g., Cu-Si) |
Extended Applications
|
| Energy Consumption | High (>200 J/mm²) |
Low (<50 J/mm²)
|
Reduce by 75% |
3. Typical Application Scenarios
① Semiconductor Packaging
- TCB Bonding: Laser local heating of the substrate (e.g., kovar alloy) combined with dynamic alignment technology enables chip interconnection with 10μm pitch, reducing thermal damage by 90%;
- 3D Integration: Laser heating of copper pillar bumps facilitates direct copper-copper bonding, reducing interfacial thermal resistance to <0.5°C·mm²/W.
② Metal Additive Manufacturing
- Powder Bed Fusion: A 9000W laser performs real-time heating of current layer powder (up to 1000°C), increasing the density of refractory materials such as titanium alloys and tungsten to 99.5%;
- Residual Stress Control: A graded cooling strategy (5°C/s → ambient temperature) suppresses part cracking, increasing fatigue life by 3 times.
③ New Energy & Electronic Manufacturing
- Battery Electrode Drying: Laser rapid curing of lithium battery cathode coatings (heating up to 400°C in 15 seconds), reducing energy consumption by 80%;
- PCB Thermal Management: Local heating of heat-dissipating substrates (e.g., aluminum nitride ceramics), increasing thermal conductivity to 250 W/m·K.
4. Future Trends
① Ultrafast Heating: Femtosecond laser (pulse width <100 fs) achieves picosecond-level temperature rise, enabling non-destructive bonding of ultra-thin chips (<10 μm);
② Green Manufacturing: Developing green lasers (532 nm) to reduce energy consumption, integrating with lead-free soldering processes to comply with RoHS standards;
③ Intelligent Upgrade: AI real-time optimization of heating parameters (response time <1 ms), defect rate reduced to <0.01%.