DYNALAS
1.Flip Chip Technology Evolution
Flip Chip connects chips to substrates directly via bumps (Bump), replacing traditional Wire Bonding (Wire Bonding). It enables higher-density I/O (over 1,000 solder joints per square millimeter), shorter electrical signal paths (reducing inductance by 50%), and improved thermal performance.
2.Limitations of Traditional Reflow Soldering
- Thermal stress issues: Bulk heating causes substrate warpage (CTE difference up to 3-5 ppm/°C);
- Low process efficiency: Batch reflow requires 30-60 minutes, which cannot meet the demands of high-density packaging;
- Insufficient precision: A positioning error of ±20μm limits the application of micro-bumps (μBump).
3.Advantages of Laser Reflow Soldering
- Localized precise heating: The laser beam (wavelengths of 980nm/1064nm) is focused to a 50μm² area, enabling micro-area melting;
- Temperature gradient control: Heating rate >100°C/s, with peak temperature 30% lower than traditional processes (220-260°C);
- Contactless processing: Avoids mechanical stress damage to ultra-thin chips (<50μm).
4.Typical Process Flow
5.Process Parameters & Performance Comparison
| Parameter | Traditional Reflow Soldering | Laser Reflow Soldering | Improvement Range |
| Heating Rate | 5-10℃/s | 100-200℃/s | 10-20 times |
| Peak Temperature | 245℃（Sn63/Pb37） | 220℃（Lead-Free Process） | Reduce by 10% |
| Thermal Stress (CTE Matching) | >150MPa（Al Substrate） | <80MPa（Si Substrate） | Reduce by 47% |
| Positioning Accuracy | ±25μm | ±5μm | Increase by 5 times |
| Applicable Bump Size | >50μm | 10-30μm | Reduce by 60% |
6.Typical Application Scenarios
①High-Performance Computing (HPC) Chips：
- CPU/GPU Packaging
- HBM Memory Stacking
②Automotive Electronics：
- ADAS Chips
- LiDAR
- Onboard Cameras
③Optoelectronic Integration：
- VCSEL Array
- Mini LED
- Micro-LED