DYNALAS builds precision laser heating systems for semiconductor packaging, advanced displays and battery manufacturing, on laser process-control technology developed in Germany since 1991. At the core of every system is closed-loop temperature control: a pyrometer measures the work surface in real time and holds the process to a defined temperature curve.

We are looking for graduates and experienced engineers from the laser, optics, software and applications fields who want to develop and deliver the next generation of laser heating solutions.

We are currently recruiting for the role below. Click the role for the full description, or email us at st@dynalas.com:

Laser Application Engineer — Semiconductor Chip Bonding
Own laser-assisted bonding processes for advanced semiconductor packaging — from process development in our application lab to installation and training on customer lines. Remote / hybrid; open to graduates and experienced engineers.

Email: st@dynalas.com