Laser die eject

In the chip rework process, the traditional method for picking up chips involves using a push pin to lift the chip off the film (which has adhesive applied). However, as chips have become thinner, many manufacturers no longer accept this approach and have shifted to using heat sources to heat the bonding interface, weakening the adhesive performance to enable easy chip pickup.

Conventional heat sources suffer from inaccurate temperature control, which can easily damage the film. Therefore, laser systems combined with high-speed closed-loop temperature control and uniform flat-top laser beams are now employed for such applications.